Medical Engineering Distinguished Seminar Series, Professor Ravinder Dahiya
Hybrid: https://caltech.zoom.us/j/83623925584 and in-person: B270 Moore.
Miniaturization-based advances in electronics have revolutionized computing and communication during the last half century. These advances have mainly come through miniaturised high-performance devices and circuits on planar and stiff substrates. However, several emerging applications and interactive systems (e.g., robots, wearables, and future vehicles, etc.) also require sensors and electronics embedded in soft and squishy materials and in flexible form factors. These requirements call for new transformative methods to realize high-performance electronics on unconventional substrates such as plastic, paper and elastomers. In this regard, printed electronics has brought a new dimension, with added benefits such as resource efficiency and sustainable manufacturing. This talk will present some of these advances, including hybrid integration of the off-the-shelf devices embedded in soft materials, printed micro/nanostructures-based CMOS electronics, and ultra-thin chips, etc., leading to fast computational or electronic skin for robotics and similar interactive systems. Electronic skin is also the key enabler for advances in emerging fields such as wearables, such as touch or haptics based augmented reality systems and healthcare technologies. This lecture will also briefly discuss these potential future directions.
Biography: Ravinder Dahiya is Professor of Electronics and Nanoengineering and EPSRC Research Fellow in the James Watt School of Engineering at University of Glasgow. His group (Bendable Electronics and Sensing Technologies (BEST)) is renowned for fundamental research in flexible printed electronics, electronic/tactile skin, and their application in robotics, wearables, augmented/virtual and similar interactive systems. Prof. Dahiya has authored or co-authored more than 400 publications, books and submitted/granted patents and disclosures. He has led or contributed to many international projects.
Prof. Dahiya is President of IEEE Sensors Council. He is the Founding Editor-in-Chief of IEEE Journal on Flexible Electronics (J-FLEX). He is the founder of IEEE International Conference on Flexible Printable Sensors and Systems (IEEE FLEPS). Prof. Dahiya has received several awards, including Technical Achievement award from IEEE Sensors Council, Young Investigator Award from Elsevier, Marie Curie Fellowship, Monbusho Fellowship, and 11 best journal/conference paper awards as author/co-author. Prof. Dahiya is Fellow of IEEE and the Royal Society of Edinburgh.
Hosted by: Wei Gao